Method for manufacturing light emitting device

ABSTRACT

A method for manufacturing a light emitting device includes: preparing a first substrate having an upper surface comprising an element placement region; placing a light emitting element in the element placement region; disposing an uncured, sheet-like light-transmissive member on the light emitting element and bringing an outer edge of a lower surface of the light-transmissive member into contact with an outer upper surface of the element placement region of the first substrate by pressing the light-transmissive member; and disposing a first protrusion portion along an outer edge of an upper surface of the light-transmissive member so that the first protrusion portion extends over the upper surface of the first substrate and the upper surface of the light-transmissive member.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Japanese Patent Application No.2021-091898 filed on May 31, 2021, the disclosure of which is herebyincorporated herein by reference in its entirety.

BACKGROUND

The present disclosure relates to a method for manufacturing a lightemitting device.

A known light emitting device including a plurality of light emittingelements is used as a light source for a vehicle or a light source for aprojector. A light emitting device used as a light source has aconfiguration in which, for example, light is emitted from the lightsource to the outside via a lens. Such a known light emitting device hasa configuration in which the plurality of light emitting elements arearrayed on a submount, the submount is mounted on a wiring board, andthe submount and the wiring substrate are connected via a wire (seeJapanese Patent Publication No. 2021-009898 No. and 2017-212301).

SUMMARY

An object of embodiments according to the present disclosure is toprovide a method for manufacturing a light emitting device with betterreliability.

A method for manufacturing a light emitting device according to anembodiment of the present disclosure includes preparing a firstsubstrate including an element placement region on an upper surface;placing a light emitting element in the element placement region;disposing an uncured, sheet-like light-transmissive member on the lightemitting element and bringing an outer edge of a lower surface of thelight-transmissive member into contact with an outer upper surface ofthe element placement region of the first substrate by pressing thelight-transmissive member; and disposing a first protrusion portionalong an outer edge of an upper surface of the light-transmissive memberso that the first protrusion portion extends over the upper surface ofthe first substrate and the upper surface of the light-transmissivemember.

According to an embodiment of the present disclosure, a method formanufacturing a light emitting device with better reliability can beprovided.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic perspective view of a light emitting deviceaccording to a first embodiment.

FIG. 2 is a schematic plan view of the light emitting device accordingto the first embodiment.

FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2 .

FIG. 4 is a cross-sectional view of a portion taken along line IV-IV inFIG. 2 .

FIG. 5 is a cross-sectional view taken along line V-V in FIG. 2 .

FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 2 .

FIG. 7 is a schematic plan view of a first protrusion portion, a secondprotrusion portion, a light-transmissive member, and wires of the lightemitting device according to the first embodiment.

FIG. 8 is a flowchart for describing a method for manufacturing thelight emitting device according to the first embodiment.

FIG. 9A is a schematic plan view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 9B is a schematic plan view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 9C is an enlarged schematic plan view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 9D is a schematic plan view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 9E is a schematic plan view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 9F is a schematic plan view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 9G is a schematic plan view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 9H is a schematic plan view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 10A is a schematic perspective view illustrating an example of atool used in the method for manufacturing the light emitting deviceaccording to the first embodiment.

FIG. 10B is a schematic cross-sectional view illustrating an example ofa tool used in the method for manufacturing the light emitting deviceaccording to the first embodiment.

FIG. 10C is an enlarged schematic cross-sectional view illustrating thetool in FIG. 10A with a portion omitted.

FIG. 11A is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 11B is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 11C is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 11D is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 11E is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 12A is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 12B is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 12C is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 13A is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 13B is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 13C is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 13D is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 13E is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the firstembodiment.

FIG. 14A is a schematic plan view illustrating a light emitting deviceaccording to a second embodiment.

FIG. 14B is a cross-sectional view illustrating a cross-section of thelight emitting device according to the second embodiment.

FIG. 14C is a flowchart illustrating a method for manufacturing thelight emitting device according to the second embodiment.

FIG. 15A is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the secondembodiment.

FIG. 15B is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the secondembodiment.

FIG. 15C is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the secondembodiment.

FIG. 15D is a schematic cross-sectional view illustrating the method formanufacturing the light emitting device according to the secondembodiment.

FIG. 16 is a schematic cross-sectional view illustrating a modifiedexample of the first embodiment.

DETAILED DESCRIPTION

Light emitting devices according to certain embodiments will bedescribed below with reference to the drawings. Note that the size,positional relationship, or the like of members illustrated in thedrawings may be exaggerated for clarity of description. In addition, thedimensions and placement positions of each member in a plan view and acorresponding cross-sectional view may not strictly match. In order toavoid excessive complication of the drawings, some elements are notillustrated, or an end view illustrating only a cut surface may be usedas a cross-sectional view. Furthermore, in the following description,up, down, left, right, front, and back are relative terms and do notindicate absolute directions. Also, members having the same terms andreference characters basically represent the same members or members ofthe same or similar material, and the repeated detailed descriptionthereof may be omitted as appropriate. Furthermore, in the embodiments,“covering” and “cover” imply not only a case with direct contact, butalso imply a case with indirect contact, that is, covering with othermembers between, for example. In the present specification, a plan viewcorresponds to observing from a light extraction surface side of a lightemitting device.

First Embodiment Configuration of Light Emitting Device According toFirst Embodiment

The configuration of a light emitting device according to the firstembodiment will be described with reference to FIGS. 1 to 7 .

FIG. 1 is an overall schematic perspective view of a light emittingdevice according to an embodiment. FIG. 2 is an overall schematic planview of a light emitting device according to the first embodiment. FIG.3 is a cross-sectional view taken along line III-III in FIG. 2 . FIG. 4is a cross-sectional view taken along line IV-IV in FIG. 2 . FIG. 5 is across-sectional view taken along line V-V in FIG. 2 . FIG. 6 is across-sectional view taken along line VI-VI in FIG. 2 . FIG. 7 is aschematic plan view of a first protrusion portion, a second protrusionportion, a light-transmissive member, and wires of the light emittingdevice according to the first embodiment.

A light emitting device 100 includes a light emitting element 1; a firstsubstrate 10 having an upper surface that includes an element placementregion 13 where the light emitting element 1 is placed; alight-transmissive member 5 that covers the light emitting element 1,the outer edge of the lower surface coming into contact with the outerupper surface of the element placement region 13 of the first substrate10; and a first protrusion portion 41 disposed along the outer edge ofthe upper surface of the light-transmissive member 5 and extending overthe upper surface of the first substrate 10 and the upper surface of thelight-transmissive member 5. Specifically, the size is such that theouter edge of the light-transmissive member 5 is located outward of theouter edge of a reflective member 7 by at least twice the thickness ofthe light emitting element 1 and such that the outer edge of thelight-transmissive member 5 is located outward of the outer edge of thereflective member 7 by at least twice the thickness of thelight-transmissive member 5, for example. The first protrusion portion41 is disposed in a rectangular frame-like shape surrounding the elementplacement region 13. The light emitting device 100 in this exampleincludes a plurality of light emitting elements 1. The plurality oflight emitting elements 1 are aligned and arranged in rows in theelement placement region 13.

Furthermore, the light emitting device 100 may include a secondsubstrate 20 having an upper surface that includes a substrate placementregion 23 where the first substrate 10 is placed; first terminals 110disposed on the upper surface outward of the element placement region 13of the first substrate 10; wires 130 that connects to second terminals120 disposed on the upper surface outward of the substrate placementregion 23 of the second substrate 20; and a covering member 40 thatcovers the wires 130. Here, the covering member 40 comes into contactwith the first protrusion portion 41 and covers the upper surface of thefirst substrate 10 located outward of the first protrusion portion 41.

Note that the light emitting device 100 may include, in the elementplacement region 13 on the first substrate 10, the reflective members 7that expose the upper surfaces of the light emitting elements 1 andcover the lateral surfaces. Furthermore, the light emitting device 100may include a second protrusion portion 42 disposed on the upper surfaceof the second substrate 20 outward of the second terminals 120 and incontact with the covering member 40.

Configurations will be each described below.

First Substrate

The first substrate 10 includes a flat plate-like support member and awiring disposed on the upper surface of the support member. The firstsubstrate 10 includes the element placement region 13 where, on theupper surface, the plurality of light emitting elements 1 are placed. Awiring that connects to the light emitting element 1 is disposed in theelement placement region 13. The first substrate 10 includes theplurality of first terminals 110 as wirings disposed on the uppersurface outward of the element placement region 13. The first terminals110 are electrically connected to the wiring disposed in the elementplacement region 13. The first substrate 10 is, for example, a siliconsemiconductor substrate or the like, and a region where the wiring onthe top surface is not disposed is covered with an insulating film. Thewiring may also be disposed in the interior or on the lower surface ofthe support member. For example, an integrated circuit (IC) substratewith an integrated circuit for controlling driving of the plurality oflight emitting elements 1 may be used for the first substrate 10.

The plurality of light emitting elements 1 are placed in a matrix in theelement placement region 13. The element placement region 13 in planview can be a rectangular region for example. The element placementregion 13 is rectangular in this example, and the first terminals 110are arranged in rows on the opposing long sides of this rectangularshape so as to sandwich the element placement region 13.

The first terminals 110 are, for example, power supply terminals of thefirst substrate and, in this example, are connected to a first end ofthe wires 130, and the first substrate 10 is electrically connected tothe second substrate via the wires 130. In this example, the pluralityof first terminals 110 are each substantially rectangular and disposed,on the upper surface of the first substrate 10, in rows along the longsides of the element placement region 13 separated from one another.

The plurality of light emitting elements 1 are placed in a matrix on thefirst substrate 10 and are electrically connected to any one of thefirst terminals 110. The plurality of light emitting elements 1 may beconnected in series or in parallel with the first terminal in groups ofa predetermined number.

The wiring can be formed, for example, using a metal such as Cu, Ag, Au,Al, Pt, Ti, W, Pd, Fe, Ni, or the like or an alloy thereof. Such awiring can be formed by electrolytic plating, non-electrolytic plating,vapor deposition, sputtering, or the like.

Second Substrate

The second substrate 20 includes a flat plate-like base body and awiring disposed on at least the upper surface of the substrate. Thesecond substrate 20 includes the substrate placement region 23 where, onthe upper surface, the first substrate 10 is placed, and furtherincludes the second terminals 120 on the upper surface located outwardof the substrate placement region 23.

The substrate placement region 23 is a region where the first substrate10 is placed. The substrate placement region 23 is set as a regionhaving an area equal to the shape of the first substrate 10 in a planview. Here, the meaning of equal encompasses tolerances caused by membertolerance and mounting tolerance in a acceptable range. When the firstsubstrate 10 is rectangular in a plan view, the substrate placementregion 23 may also be rectangular.

The second terminals 120 are located outward of the substrate placementregion 23 and are arranged in rows on opposing long sides of therectangular substrate placement region 23. The second terminals 120 areterminals connected to the second ends of the wires 130 that include thefirst ends connected to the first terminals 110. In this example, thesecond terminals 120 are each substantially rectangular and aligned, onthe upper surface of the second substrate 20, in rows along thesubstrate placement region 23 separated from one another.

The second terminals 120 can be formed, for example, by a material and aforming method similar to that of the wiring of the first substrate 10described above.

For the base body, a material having high heat dissipation is preferablyused, and a material having a high light shielding property and basebody strength is more preferably used. Specific examples include aceramic such as alumina, aluminum nitride, mullite, and the like; aresin such as phenol resin, epoxy resin, polyimide resin, BT resin(bismaleimide triazine resin), polyphthalamide (PPA), and the like; acomposite material formed from a resin and a metal or a ceramic; and thelike. A flat plate-like base body may be used, and a base body with acavity in the upper surface may be used. In this case, the substrateplacement region of the second substrate 20 can be the bottom of thecavity, and the first substrate 10 can be placed inside the cavity.

The second substrate 20 may include a wiring for placing the firstsubstrate 10 on the surface of the substrate placement region 23. Thefirst substrate 10 and the second substrate 20 can be joined via abonding material such as an Ag sintered body, solder, an adhesive resin,and the like.

Wire

Examples of the wire 130 include an electrical conductive wirecontaining a metal such as Au, Cu, Pt, Al and/or an alloy containing atleast these metals. In particular, Au having good thermal resistance andthe like is preferably used. The diameter of the wire is in a range, forexample, from 15 μm to 50 μm. Note that in this example, the wire 130includes a first wire 31, a second wire 32, and a third wire 33 withlengths from one another. The first wire 31, the second wire 32, and thethird wire 33 can each be formed of a similar member.

The wire 130 may be disposed so as to extend across the long side of thesubstantially rectangular first substrate 10 in a plan view and, forexample, run substantially orthogonal to the long side.

Light Emitting Element

For example, the light emitting element 1 has a substantiallyrectangular shape in a plan view and includes a semiconductor layeredbody and a positive and negative electrode disposed on the surface ofthe semiconductor layered body. The light emitting element 1 includes apositive and negative electrode on the same surface side and is mountedon the first substrate 10 with the surface provided with the electrodesas the lower surface and the lower surface facing the upper surface ofthe first substrate 10. In this case, the upper surface facing thesurface where the electrodes are disposed is a main light extractionsurface of the light emitting element 1. Note that in the light emittingdevice 100, the light emitting elements 1 are placed on the firstsubstrate 10 and aligned in a row at predetermined intervals in thematrix direction. The size and number of the light emitting elements 1used can be selected as appropriate depending on the form of the desiredlight emitting device. Of these, smaller light emitting elements 1 arepreferably placed at a higher density. This allows the irradiation rangeto be controlled in a larger number of divisions and allows the lightemitting elements 1 to be used as a light source of a high resolutionillumination system. For example, 1000 to 20000 rectangular lightemitting elements 1 having a single side in a range from 40 μm to 100 μmin a plan view may be placed in a matrix-like shape forming an overallrectangular shape.

For the light emitting elements 1, any wavelength can be selected. Forexample, a ZnS or nitride semiconductor (In_(X)Al_(Y)Ga_(1−X−Y)N, 0≤X,0≤Y, X+Y≤1) and GaP can be selected to be used for the blue or greenlight emitting elements 1. For the red light emitting elements 1, asemiconductor represented by GaAlAs and AlInGaP can be suitably used.Furthermore, a semiconductor light emitting element made from othermaterials can be used. The composition and light emission color of thelight emitting elements 1 used can be selected as appropriate inaccordance with an intended purpose.

Bond Member

Note that, as illustrated in FIG. 6 , the light emitting elements 1 arejoined by an electrical conductive bond member on a wiring disposed inthe element placement region 13 of the first substrate 10. In a case inwhich the light emitting elements 1 are flip chip mounted on the firstsubstrate 10, a bump formed from a metal material such as Au, Ag, Cu,Al, and the like can be used as the bond member. Furthermore, a soldersuch as an AuSn-based alloy and an Sn-based lead-free solder may be usedas the bond member. In this case, the light emitting elements 1 can bebonded to the first substrate 10 by a reflow method. In addition, anelectrical conductive adhesive containing electrically conductiveparticles in the resin can be used as the bond member. The bond betweenthe light emitting elements 1 and the first substrate 10 may be formedusing a plating method. Examples of the plating material include Cu.

In addition, the bond between the light emitting elements 1 and thefirst substrate 10 may be formed by directly joining together theelectrodes of the light emitting elements 1 and the wirings of the firstsubstrate 10 without interposing the bond member.

Reflective Member

As illustrated in FIG. 6 , the reflective members 7 are members thatcover the upper surface of the first substrate 10 and the lateralsurfaces of the light emitting elements 1. The upper surfaces of thelight emitting elements 1 are exposed from the reflective members 7. Thereflective members 7 may cover the space between the lower surfaces ofthe light emitting elements 1 and the first substrate 10. The reflectivemember 7 can reflect light emitted from the lateral surface of the lightemitting element 1 and emit light from the upper surface of the lightemitting surface of the light emitting device 100, i.e., thelight-transmissive member 5. Thus, the light extraction efficiency ofthe light emitting device 100 can be improved. In addition, when thelight emitting elements 1 are individually lit, the boundary between thelight emitting area and the non-light-emitting area can be made clear.This improves the contrast ratio between the light emitting areas andthe non-light-emitting areas. The reflective members 7 may be separatedfrom the first protrusion portion 41 or may be disposed in contact withthe first protrusion portion 41.

For the reflective member 7, a soft resin having relatively lowelasticity and good shape conformability is preferably used.Specifically, for the reflective member 7, a white resin containingparticles of a light-reflective substance in a light-transmissive resinforming a base body is preferably used. Examples of thelight-transmissive resin include a silicone resin, a modified siliconeresin, an epoxy resin, a modified epoxy resin, an acrylic resin, and aresin such as a hybrid resin containing at least one type of theseresins. Among these, a silicone resin having good heat resistance andlight resistance is preferably used, and a dimethyl silicone resin ismore preferably used. A dimethyl silicone resin has good reliabilitysuch as higher temperature resistance and the like, and thus can besuitably used as a material for vehicle-mounted applications. Examplesof suitable light-reflective substances include titanium oxide, aluminumoxide, zinc oxide, barium carbonate, barium sulfate, boron nitride,aluminum nitride, glass filler, and the like. Note that the reflectivemember 7 may contain a light absorbing material such as a carbon blackor graphite.

Light-Transmissive Member

The light-transmissive member 5 has light transmissivity and covers theupper surfaces of the plurality of light emitting elements 1. Thelight-transmissive member 5 collectively covers the upper surfaces ofthe plurality of light emitting elements 1 and the upper surfaces andlateral surfaces of the reflective members 7. The upper surface of thelight-transmissive member 5 configures the light emitting surface of thelight emitting device 100. The light-transmissive member 5 may include alight-transmissive resin that forms at least a base body and may includea wavelength conversion member in the base body. In this example, forexample, the light-transmissive member 5 contains a wavelengthconversion member, and at least a portion of the light emitted from thelight emitting elements 1 is subject to wavelength conversion and thenextracted to the outside.

The light-transmissive member 5 is substantially rectangular in a planview and contains the plurality of light emitting elements 1. An outeredge 51 of the lower surface of the light-transmissive member 5 isdisposed in contact with the upper surface of the outer side of theelement placement region 13 of the first substrate 10.

For example, in the manufacturing process described below, the uncuredlight-transmissive member 5 formed in a sheet-like shape covers thelight emitting elements 1 and the reflective members 7, thelight-transmissive member 5 can be obtained via softening by heating orthe like and deformation along the surface shape of the reflectivemember 7. The light-transmissive member 5 is cured while in a state ofbeing in contact with the upper surface of the light emitting elements1, the upper surface and the outer surface of the reflective member, andthe upper surface of the first substrate 10. Note that in the presentembodiment, the uncured light-transmissive member 5 formed in asheet-like shape is disposed on the light emitting element 1 using acollet 60 (see FIG. 10A), and furthermore, by pressing the outer edge ofthe upper surface with the collet 60, the lower surface of thelight-transmissive member 5 is brought into contact with the firstsubstrate 10, deforming the light-transmissive member 5. In this manner,the light-transmissive member 5 can be bonded more firmly on thesubstrate 10. The collet 60 is preferably shaped so as to be able topress on at least a portion and preferably all of the outer edge of thelight-transmissive member 5. For example, in a case in which thelight-transmissive member 5 has a rectangular shape in a plan view, thecollet 60 is preferably in a shape that can press at least two opposingsides of the outer edge of the four sides, and more preferably a shapethat can press all four sides. The collet 60 is preferably in a shapethat is formed to match the shape of the outer edges of thelight-transmissive member 5 in a plan view.

The light-transmissive member 5 may be formed in a sheet-like shape or aplate-like shape and disposed on the light emitting element 1.Alternatively, it can be formed by injection molding, transfer molding,compression molding, or the like by using a mold and the like.Furthermore, as the light-transmissive member 5, an uncured sheet-likemember may be disposed on the light emitting elements 1 and thereflective members 7 using a tool such as the collet 60 (see FIG. 10A).Of these, the uncured sheet-like light-transmissive member 5 ispreferably disposed on the light emitting elements 1 and the reflectivemembers 7 using the collet 60 or the like and pressed. Note that theconfiguration of the collet 60 will be described in detail in themanufacturing method described below. The light-transmissive member 5 isdisposed in a manner so that, via being pressed, the outer edge 51 ofthe lower surface comes into contact with the upper surface of the firstsubstrate 10. This improves the adhesion to the first substrate 10.

Examples of the light-transmissive member 5 containing the wavelengthconversion member include a member containing a phosphor powder in alight-transmissive resin forming the base body. As the base body, aresin similar to the resin used for the base body of the reflectivemember 7 described above can be used. The thickness of thelight-transmissive member 5 can be in a range, for example, fromapproximately 20 μm to 100 μm. Note that the light-transmissive member 5is formed with a size allowing it to cover all of the upper surface ofthe plurality of light emitting elements 1 and the reflective members 7and allowing the outer edge 51 of the lower surface to come into contactwith the first substrate 10. Specifically, the size is such that theouter edge of the light-transmissive member 5 is located outward of theouter edge of a reflective member 7 by at least twice the thickness ofthe light emitting element 1 and such that the outer edge of thelight-transmissive member 5 is located outward of the outer edge of thereflective member 7 by at least twice the thickness of thelight-transmissive member 5, for example. Also, the light-transmissivemember 5 is provided on the first substrate 10 and extends to a positioncovered by the first protrusion portion 41 described below.

Examples of the phosphor include an yttrium aluminum garnet basedphosphor (for example, Y₃(Al,Ga)₅O₁₂:Ce), a lutetium aluminum garnetbased phosphor (for example, Lu₃(Al,Ga)₅O₁₂:Ce), a terbium aluminumgarnet based phosphor (for example, Tb₃(Al,Ga)₅O₁₂:Ce), a CCA basedphosphor (for example, Ca₁₀(PO₄)₆Cl₂:Eu), an SAE based phosphor (forexample, Sr₄Al₁₄O₂₅:Eu), a chlorosilicate based phosphor (for example,Ca₈MgSi₄O₁₆Cl₂:Eu), a β-SiALON based phosphor (for example,(Si,Al)₃(O,N)₄:Eu), an α based SiAlON phosphor (for example,Ca(Si,Al)₁₂(O,N)₁₆:Eu), an SLA based phosphor (for example,SrLiAl3N₄:Eu), a nitride based phosphor such as a CASN based phosphor(for example, CaAlSiN₃:Eu) or an SCASN based phosphor (for example,(Sr,Ca)AlSiN₃:Eu), a fluoride phosphor such as a KSF based phosphor (forexample, K₂SiF₆:Mn), a KSAF based phosphor (for example, K₂(Si,Al)F₆:Mn) or an MGF based phosphor (for example, 3.5MgO0.5MgF₂GeO₂:Mn),a phosphor having a perovskite structure (for example,CsPb(F,Cl,Br,I)₃), a quantum dot phosphor (for example, CdSe, InP,AgInS₂, or AgInSe₂), and the like.

The KSAF based phosphor may have a composition represented by Formula(I) below.

M2[Si_(p)Al_(q)Mn_(r)F_(s)]  (I)

In Formula (I), M represents an alkali metal and may include at least K.Mn may be a tetravalent Mn ion. p, q, r, and s may satisfy0.9≤p+q+r≤1.1, 0<q≤0.1, 0<r≤0.2, 5.9≤s≤6.1. Preferably 0.95≤p+q+r≤1.05or 0.97≤p+q+r≤1.03, 0<q≤0.03, 0.002≤q≤0.02 or 0.003≤q≤0.015,0.005≤r≤0.15, 0.01≤r≤0.12 or 0.015≤r≤0.1, 5.92≤s≤6.05 or 5.95≤s≤6.025.Examples thereof include compositions represented by K₂[Si_(0.946)Al_(0.005)Mn_(0.049)F_(5.995)], K₂[Si_(0.943)Al_(0.008)Mn_(0.050)F_(5.992)]. K₂[Si_(0.939)Al_(0.014)Mn_(0.047)F_(5.986)]. According to such a KSAFbased phosphor, a red light emission having a high luminance and anarrow half band width of the light emission peak wavelength can beobtained.

Covering Member

The covering member 40 is a resin with light shielding properties thatcovers the wires 130 located outward of the element placement region 13.As an example, the covering member 40 is disposed in a frame-like shapein a plan view covering the wires 130 and surrounding the elementplacement region 13. The covering member 40 is disposed in contact withthe first protrusion portion described below.

The covering member 40 disposed in a frame-like shape has a greaterwidth in the region on the long side sides of the rectangle of the firstsubstrate 10 with a substantially rectangular shape in a plan view thanin the region on the short sides. Furthermore, the covering member 40 isdisposed with a height (that is, the distance from the upper surface ofthe second substrate 20 to the upper surface of the covering member 40)the highest directly above a top portion 130 a of the wire 130 (here,the loop top of the wire). In other words, the covering member 40 isdisposed with a top portion 40 a of the covering member 40 overlappingwith the top portion 130 a of the wire 130. Note that the position ofthe top portion 40 a of the covering member 40 is positioned above a topportion 41 a of the first protrusion portion 41 described later.

Examples of the covering member 40 with light shielding propertiesinclude a resin containing a filler having light shielding properties.Examples of the resin forming the base body include a silicone resin, amodified silicone resin, an epoxy resin, a modified epoxy resin, anacrylic resin, and the like. Examples of the filler having lightshielding properties include light absorbing substances such as pigment,carbon black, graphite, and the like; light-reflective substances thesame as or similar to the light-reflective substances included in thereflective member described above; and the like. Specific examplesinclude white resin having good light reflectivity, black resin havinggood light absorption, and gray resin having light reflectivity andlight absorption. Furthermore, the covering member 40 may include layersof these resin layers.

Of these, taking into consideration the deterioration of resin due tolight absorption, a white resin having light reflectivity is preferablyused at least on the outermost surface of the covering member 40.

First Protrusion Portion and Second Protrusion Portion

The light emitting device 100 includes the first protrusion portion 41disposed along the outer edge of the upper surface of thelight-transmissive member 5 and extending over the upper surface of thefirst substrate 10 and the upper surface of the light-transmissivemember 5. The first protrusion portion 41 is disposed in a frame-likeshape surrounding the element placement region 13 in a plan view.Specifically, the first protrusion portion 41 is disposed on the firstsubstrate 10 between the element placement region 13 and the firstterminals 110 along the outer edge of the upper surface of thelight-transmissive member 5, covers the outer edge 51 of the uppersurface of the light-transmissive member 5, and is in contact with theupper surface of the first substrate 10. Accordingly, in the lightemitting device 100, the adhesion between the light-transmissive member5 and the first substrate 10 can be improved, and the light emittingdevice 100 with good reliability can be achieved. In addition, becausethe upper surface of the first substrate 10 is not exposed in the regionsurrounded by the first protrusion portion 41 on the upper surface ofthe light emitting device 100, wiring line and the like disposed in theelement placement region 13 can be protected from dust and dirt,moisture, external forces, and the like. In this manner, the lightemitting device 100 having even better reliability can be achieved.

Furthermore, the light emitting device 100 may include the secondprotrusion portion 42 that comes into contact with the covering member40 on the upper surface of the second substrate 20. In this case, thesecond protrusion portion 42 is disposed in a frame-like shapesurrounding the first substrate 10, and the covering member 40 isdisposed between the first protrusion portion 41 and the secondprotrusion portion 42 extending from the upper surface of the firstsubstrate 10 across to the upper surface of the second substrate 20. Inother words, the covering member 40 is disposed between the firstprotrusion portion 41 surrounding the element placement region 13 on thefirst substrate 10 and the second protrusion portion 42 surrounding thesubstrate placement region 23 on the second substrate 20. Thearrangement of the covering member 40 configured as such can be formedby supplying uncured resin for forming the covering member 40 in a framesurrounded by the first protrusion portion 41 and the second protrusionportion 42. In other words, the first protrusion portion 41 and thesecond protrusion portion 42 can be used as a dam to dam the flow of theuncured resin when the covering member 40 is supplied. For example, thecovering member 40 is disposed in contact with the top portion of eachof the first protrusion portion 41 and the second protrusion portion 42.

The first protrusion portion 41 and the second protrusion portion 42 canbe set to a predetermined height by providing the uncured resin inlayers in the height direction. For example, the first protrusionportion 41 and the second protrusion portion 42 are disposed with apredetermined height by disposing one layer of a resin adjusted to apredetermined viscosity from the nozzle on a substrate and repeating theoperation.

The first protrusion portion 41 and the second protrusion portion 42 maybe light-transmissive to light emitted from the light emitting element 1and the light-transmissive member 5 or may have light shieldingproperties. As the material for the first protrusion portion 41 and thesecond protrusion portion 42, the material used for the base body of thecovering member 40 described above can be used. Note that the resin forforming the first protrusion portion 41 and the second protrusionportion 42 preferably has higher viscosity than the viscosity of theresin for forming the covering member 40. The viscosity of the resin canbe adjusted by, for example, adjusting the amount of a filler forviscosity adjustment contained in the resin.

In a plan view, the first protrusion portion 41 covers the outer edge 51of the upper surface of the light-transmissive member 5 and is disposedin contact with the upper surface of the light-transmissive member 5 andthe upper surface of the first substrate 10. Specifically, the firstprotrusion portion 41 is disposed in contact with a portion of the uppersurface of the light-transmissive member 5 where a portion of the lowersurface of the light-transmissive member 5 is in contact with the uppersurface of the first substrate 10, and disposed in contact with theupper surface of the first substrate 10. In this manner, the end portionof the light-transmissive member 5 is disposed between the lower surfaceof the first protrusion portion 41 and the upper surface of the firstsubstrate 10. This suppresses peeling of the light-transmissive member 5from the first substrate 10 and improves the adhesion between thelight-transmissive member 5 and the first substrate 10. In other words,by the light emitting device including the first protrusion portion 41,peeling of the light-transmissive member 5 from the upper surface of thefirst substrate 10 can be suppressed, and a light emitting device withgood reliability can be achieved.

The light emitting device 100 with the configuration described above canbe used as a light source of a headlight of a vehicle for example. Inthe configuration of this case, light is emitted from the light sourceto the outside via a lens. In the light emitting device 100, the lightemitting elements 1 are turned on by an external power supply switch.Note that the light emitting device 100 is configured such that a presetportion or all of the light emitting elements 1 are able to beindividually driven.

Method for Manufacturing Light Emitting Device According to FirstEmbodiment

Next, a method for manufacturing a light emitting device will bedescribed with reference to FIGS. 8 and 9A to 9H.

FIG. 8 is a flowchart for describing a method for manufacturing a lightemitting device according to the first embodiment. FIGS. 9A to 9H areschematic plan views illustrating the method for manufacturing the lightemitting device according to the first embodiment. Note that, althoughthe light emitting elements 1 are placed at a predetermined interval,the light emitting elements 1 are illustrated with the interval omittedexcept in the enlarged plan view of FIG. 9C.

A method for manufacturing a light emitting device includes a substratepreparation step S10 of preparing a first substrate including an elementplacement region on an upper surface; an element placement step S11 ofplacing light emitting elements in the element placement region of thefirst substrate; a light-transmissive member disposing step S15 ofdisposing an uncured, sheet-like light-transmissive member on the lightemitting elements and bringing an outer edge of a lower surface of thelight-transmissive member into contact with an outer upper surface ofthe element placement region of the first substrate by pressing thelight-transmissive member; and a first protrusion portion disposing stepS16 of disposing a first protrusion portion along an outer edge of anupper surface of the light-transmissive member so that the firstprotrusion portion extends over the upper surface of the first substrateand the upper surface of the light-transmissive member. Furthermore, themethod for manufacturing a light emitting device may include a secondsubstrate preparation step of preparing a second substrate including asubstrate placement region on an upper surface; a substrate placementstep of placing the first substrate in the substrate placement region ofthe second substrate; a wire disposing step of disposing a wire thatelectrically connects the first substrate and the second substrate; anda covering member disposing step of disposing a covering member thatcovers the wire. Furthermore, prior to the light-transmissive memberdisposing step, a light-transmissive member preparation step ofpreparing a support film and a light-transmissive member to be disposedon the support film may be included. Note that both the first protrusionportion disposing step S16 and the second protrusion portion disposingstep S17 may be performed before or after one another or at the sametime. Each step will be described below.

The substrate preparation step S10 is a step of preparing the firstsubstrate 10 including the element placement region 13 on the uppersurface. As the first substrate 10, it is preferable to prepare thefirst substrate 10 in which the wirings such as the first terminal 110are disposed in advance in the element placement region 13 and aroundthe element placement region. The wirings such as the first terminal 110can be formed by applying a metal foil of Cu, Al, or the like; applyinga metal powder paste of Cu, Ag, or the like; or plating of Cu or thelike. The wirings may be formed by sputtering, vapor deposition, or thelike. Note that the first substrate 10 may be prepared by purchasing it.

The element placement step S11 is a step of placing the plurality oflight emitting elements 1 in the element placement region 13 of thefirst substrate 10. The light emitting elements 1 can be flip chipmounted in the element placement region 13 on the first substrate 10 viaan electrically conductive bond member such as, for example, eutecticsolder, a conductive paste, a bump, plating, and the like. The lightemitting elements 1 are aligned and placed in rows in the elementplacement region 13 in a matrix direction with a predetermined intervalbetween the light emitting elements 1. The light emitting elements 1 canbe prepared through some or all of the manufacturing processes, such asthrough a step of semiconductor growth. Alternatively, the lightemitting elements 1 may be prepared by purchasing them.

A reflective member disposing step S12 is a step of covering the lateralsurface of the light emitting elements 1 with a reflective member afterthe light emitting elements 1 are placed in the element placement region13 of the first substrate 10. Here, after the light emitting elements 1are placed on the first substrate 10, white resin, which is an exampleof the reflective member, is disposed on the lateral surface of thelight emitting elements 1 between the light emitting elements 1. Thereflective member can be formed by, for example, compression molding,transfer molding, potting, printing, spraying, or the like.

A substrate placement step S13 is a step of placing the first substrate10 in the substrate placement region 23 of the second substrate 20.Here, the first substrate 10 on which the light emitting elements 1 areplaced is disposed in the substrate placement region 23 of the secondsubstrate 20 and, for example, is joined via a bonding material such asa sintered Ag. Note that, prior to performing the substrate placementstep S13, it is preferable to prepare the second substrate 20 in whichwirings such as the second terminal 120 are disposed in advance.

In a wire connecting step S14, the first terminals 110 of the firstsubstrate 10 and the second terminals 120 of the second substrate 20 areconnected with the wires 130.

Preferably, the wires 130 are preferably connected to the secondterminals 120 on the second substrate 20 after first being connected tothe first terminals 110 on the first substrate 10. By connecting thewires 130 in this order, the top portions of the wires 130 can bepositioned closer to the first terminals 110. That is, because the wires130 can be formed along the step between the first substrate 10 and thesecond substrate 20, in the covering member disposing step S18 describedlater, the amount of resin disposed below the wires 130 can be reduced,and breakage of the wires 130 due to thermal expansion of the coveringmember can be suppressed.

The light-transmissive member disposing step S15 is a step of disposingthe light-transmissive member 5 covering the plurality of light emittingelements 1 and the reflective members 7. In this step, first, thelight-transmissive member 5, which includes a wavelength conversionmember, is formed in a sheet-like shape with a size that allows it tocontain all of the light emitting elements 1 and the reflective members7 placed on the first substrate 10, and is uncured or partially cured,is prepared and disposed on the light emitting elements 1. Thelight-transmissive member 5 may be fixed on the light emitting elements1 via a light-transmissive bond member such as a resin, or may be fixedusing the tackiness property of the light-transmissive member or thelike without using a bond member. Note that here, for example, thelight-transmissive member 5 is disposed using the collet 60 providedwith a suction head 65, as illustrated in FIGS. 10A to 10C. Thelight-transmissive member disposing step using the collet 60 will bedescribed in detail below.

The collet 60 includes the suction head 65 with a suction surface 61 ata tip and a hollow tube 66 that is continuous with the suction head 65.In addition, in this example, in the collet 60, the suction head 65 isdetachably connected via an attachment portion 67. The collet 60 isconfigured to be used connected to a suction device and is configured tobe able to move a member such as the light-transmissive member 5 heldvia suction at the suction head 65 from a predetermined position to bedisposed at a target position. For example, the suction head 65 includesthe substantially rectangular suction surface 61. The suction surface 61comes into contact with the upper surface of the light-transmissivemember 5 and holds the light-transmissive member 5 via suction. Thesuction surface 61 includes a frame portion 64 that comes into contactwith the outer edge 51 of the upper surface of the light-transmissivemember 5 and flat portions 62 and groove portions disposed inalternating rows in the region inward from the frame portion 64. Aplurality of suction holes 63 are formed at predetermined intervals inthe groove portion. The region where the frame portion 64 comes intocontact with the light-transmissive member 5 is a region covered by thefirst protrusion portion 41 in the first protrusion portion disposingstep S16 described below. Thus, the width of the frame portion 64 ispreferably ½ or greater of the width of the first protrusion portion 41,and is preferably not more than twice the width of the first protrusionportion 41 from the perspective of keeping the light emitting device acompact size.

The frame portion 64 includes a step T between it and the flat portions62 and has a shape such that the periphery of the flat portions 62protrude downward. The step T is set to match the height of the lightemitting elements 1 where the light-transmissive member 5 is disposed.The frame portion 64 and the flat portions 62 are connected via aninclined surface. An inclination angle θ of the inclined surface is inthe range of from 10 degrees to 20 degrees, for example. With this stepT, the outer edge 51 of the upper surface of the light-transmissivemember 5 can be pressed against the upper surface of the first substrate10. By the suction surface 61 suctioning the light-transmissive member 5from the suction holes 63, the light-transmissive member 5 is held viasuction, with the frame portion 64 being brought into contact with theouter edge 51 of the upper surface of the light-transmissive member 5and the flat portions 62 being brought into contact with the region ofthe light-transmissive member 5 where the light emitting elements aredisposed. Note that in a case in which the light-transmissive member 5is held via suction by the collet 60 and transported, the preparedlight-transmissive member 5 has a sheet-like shape having a preset size.

The light-transmissive member preparation step will now be described. Inthe light-transmissive member preparation step, a support film and alight-transmissive member disposed on the support film are prepared.Specifically, as illustrated in FIGS. 13A to 13E, the uncuredlight-transmissive member 5 formed in a sheet-like shape with the presetsize is disposed on the support film and prepared.

First, an uncured light-transmissive member 5PS containing a phosphor inthe resin of the base body is prepared and applied on a first supportfilm SA1. The first support film SA1 is preferably used as a releasetreatment to the surface. The uncured light-transmissive member 5PS canbe applied to a sheet having a constant thickness on the surface of thefirst support film SA1 by using a squeegee SK or the like. In thismanner, a sheet-like uncured light-transmissive member 5P is obtained.Thereafter, heat treatment is performed to maintain the shape of theuncured light-transmissive member 5P. The heat treatment is preferablyperformed at a temperature and time such that the uncuredlight-transmissive member 5P does not reach complete curing.Subsequently, a second support film SA2 is prepared and disposed on asurface on the side opposite to the surface of the sheet-like uncuredlight-transmissive member 5P in contact with the first support film SA1.At this time, the second support film SA2 is preferably used as arelease treatment to the surface on the side in contact with thelight-transmissive member 5P. In this manner, the uncured sheet-likelight-transmissive member 5P sandwiched by the first support film SA1and the second support film SA2 is obtained.

Next, the uncured sheet-like light-transmissive member 5P is cut to apredetermined size while sandwiched by the first support film SA1 andthe second support film SA2. At this time, the cut is made from thefirst support film side with the surface on the second support film SA2secured. Specifically, the surface of the second support film SA2 on theside opposite to the side in contact with the light-transmissive member5P is fixed on an adhesive sheet BS, and the first support film SA1, thelight-transmissive member 5, and the second support film SA2 are shapedto the desired shape using a blade or the like. In this manner, thefirst support film SA1 and the light-transmissive member 5 disposed onthe first support film SA1 can be prepared. Note that thelight-transmissive member 5P disposed on the first support film SA1 isfixed to the adhesive sheet BS via the second support film SA2 until itis held via suction by the collet 60.

As illustrated in FIGS. 12A to 12C, the collet 60 holds via suction andtransports the light-transmissive member 5P formed in a sheet-like shapehaving a preset size. As described above, the light-transmissive member5P is sandwiched between the first support film SA1 and the secondsupport film SA2, and the first support film SA1 is fixed to the collet60 side. By bringing the first support film SA1 into contact with thesuction surface 61, the collet 60 holds via suction thelight-transmissive member 5, by holding via suction the first supportfilm SA1, disposed on the surface of the first support film SA1 on theside opposite to the side that comes into contact with the collet 60. Atthis time, the light-transmissive member 5P is peeled off from thesecond support film SA2 and transported. Specifically, the collet 60 ismoved to an opposing position above the transported light-transmissivemember 5P, and a push-up pin PU is brought into contact with the lowersurface of the adhesive sheet BS and pushes from below. When the collet60 rises while holding via suction the first support film SA1 and thelight-transmissive member 5, the push-up pin PU lowers and is put onstandby for the next operation. Note that the push-up pin PU being puton standby for the next operation may include being configured to moveto a position where the push-up pin PU pushes up next or may includemoving the adhesive sheet BS.

As illustrated in FIGS. 11A to 11E, the collet 60 holds via suction theuncured sheet-like light-transmissive member 5P by holding the firstsupport film SA1 and moves above the first substrate 10. Then, the heldlight-transmissive member 5P is moved down by the collet 60 to cover theupper surfaces of the light emitting elements 1 and the reflectivemembers 7 of the first substrate 10 and the lateral surfaces of thereflective members 7. Then, the collet 60 releases hold via suction withthe outer edge 51 of the upper surface of the light-transmissive member5P being pressed against the upper surface of the first substrate 10 bythe frame portion 64. In this manner, the light emitting elements 1 andthe reflective members 7 are covered, and the light-transmissive member5P with the outer edge of the lower surface in contact with the firstsubstrate 10 is disposed. Thereafter, the first support film SA1 ispeeled off from the light-transmissive member 5P and removed. In thelight-transmissive member 5P, by increasing the distance of the step Tbetween the frame portion 64 and the flat portions 62 in the collet 60from the upper surface of the first substrate 10 to the upper surface ofthe light emitting elements 1, the region near the outer edge of theupper surface of the light-transmissive member 5P is more stronglypressed than the region directly above the light emitting elements 1. Inthis manner, a thickness D1 of the region covering the region directlyabove the light emitting elements 1 and a thickness D2 of the region incontact with the first substrate 10 has the relationship D1>D2. Then,after the uncured light-transmissive member 5P is cured, the firstprotrusion portion 41 is disposed via the first protrusion portiondisposing step S16.

The first protrusion portion disposing step S16 is a step of disposingthe light-transmissive first protrusion portion 41 across the uppersurface of the light-transmissive member 5 and the upper surface of thefirst substrate 10 between the element placement region 13 and the firstterminals 110 on the upper surface of the first substrate 10. In thefirst protrusion portion disposing step S16, the first protrusionportion 41 can be disposed by supplying the uncured resin for formingthe first protrusion portion 41 from the nozzle of a dispenser whilemoving the nozzle along the element placement region 13 of thelight-transmissive member 5. Note that regarding the height from theupper surface of the first substrate 10 to the upper surface of thelight-transmissive member 5, the height at the upper surface outer edgeof the light-transmissive member 5 (in other words, the region incontact with the upper surface of the first substrate) is less than atthe upper surface central region of the light-transmissive member 5 (inother words, the region directly above the light emitting elements 1).The first protrusion portion 41 covers this low region. This cansuppress crawling of the uncured resin forming the first protrusionportion 41 on the upper surface (in other words, the light emittingsurface of the light emitting device 100) of the light-transmissivemember 5 covering the light emitting elements 1 when the firstprotrusion portion 41 is supplied.

In the second protrusion portion disposing step S17, the secondprotrusion portion 42 is disposed on the upper surface of the secondsubstrate 20 outward of the second terminals 120. Note that the samematerial is preferably used for the first protrusion portion 41 and thesecond protrusion portion 42, and this allows the first protrusionportion disposing step S16 and the second protrusion portion disposingstep S17 to be performed in the same step.

Note that regarding the first protrusion portion disposing step S16 andthe second protrusion portion disposing step S17, the second protrusionportion 42 may be disposed first in the second protrusion portiondisposing step S17, and then the first protrusion portion 41 may bedisposed in the first protrusion portion disposing step S16.Furthermore, the first protrusion portion disposing step S16 may beperformed simultaneously with the second protrusion portion disposingstep S17, and the first protrusion portion 41 and the second protrusionportion 42 may be disposed at substantially the same time.

The covering member disposing step S18 is a step of bringing thecovering member 40 into contact with the first protrusion portion 41 anddisposing the covering member 40 with light shielding properties thatcovers the wires 130 outward of the first protrusion portion 41.

Specifically, this is a step of disposing the covering member 40 withlight shielding properties including a base body of a resin with aviscosity less than that of the first protrusion portion 41 and thesecond protrusion portion 42 between the first protrusion portion 41 andthe second protrusion portion 42. The covering member 40 is disposedacross the first substrate 10 and the second substrate 20. Thus, thecovering member 40 also covers the lateral surface of the firstsubstrate 10. Note that the position of the top portion 40 a of thecovering member 40 disposed in the covering member disposing step S18 isset to be a position higher than the top portion 41 a of the firstprotrusion portion 41. In setting the position of the top portion 40 aof the covering member 40 to be higher than the top portion 41 a of thefirst protrusion portion 41, for example, the supplied resin ispreferably repeatedly supplied before the resin is cured. The supply ofthe covering member 40 is preferably performed from directly above thetop portion of the wire. Accordingly, the top portion of the wire iseasily covered by the covering member 40.

In the first protrusion portion disposing step S16, the secondprotrusion portion disposing step S17, and the covering member disposingstep S18, for example, the first protrusion portion 41 and the secondprotrusion portion 42 are silicone resins, and the covering member 40 isalso a silicone resin. The viscosity of the uncured resin forming thecovering member 40 can be adjusted by adding a filler for adjusting thephysical properties or viscosity of the resin used in the resin and thelike. Furthermore, in these steps, disposing the first protrusionportion 41 and the second protrusion portion 42 also includes disposinguncured or preferably a temporarily cured resin material and is notlimited to o only a case in which disposing includes completion of fullcuring.

Second Embodiment Configuration of Light Emitting Device According toSecond Embodiment

Next, a light emitting device according to the second embodiment will bedescribed with reference to FIGS. 14A and 14B. FIG. 14A is a schematicplan view of a light emitting device 101 according to the secondembodiment. FIG. 14B is a cross-sectional view taken along a lineXIVB-XIVB in FIG. 14A. Note that members with the same configurationdescribed above are denoted by the same reference numerals, followed byan English character “H” applied, and the description thereof will beomitted as appropriate.

The light emitting device 101 includes a light emitting element 1H; afirst substrate 10H including an element placement region 13H where, onan upper surface, the light emitting element 1H is placed; alight-transmissive member 5H that covers the light emitting element 1H,the outer edge 51 of the lower surface coming into contact with an outerside of the upper surface of the element placement region 13H of thefirst substrate 10H; and a first protrusion portion 41H disposed alongthe outer edge 51 of the upper surface of the light-transmissive member5H and extending over the upper surface of the first substrate 10H andthe upper surface of the light-transmissive member 5H.

The first substrate 10H includes an element placement region 13H on theupper surface, and wirings connected to the light emitting element 1H isdisposed in the element placement region 13H. In addition, regarding thefirst substrate 10H, the second substrate or the wiring for electricallyconnecting to the outside is disposed at at least one of the lowersurface, the lateral surface, or the substrate upper surface outer edgeside.

The light-transmissive member 5H extends from the upper surface of thelight emitting element 1H to the outer upper surface of the elementplacement region of the first substrate 10H so that the outer edge 51 ofthe lower surface comes into contact with the upper surface of the firstsubstrate 10H. As described in the first embodiment, for example, alight-transmissive resin such as a silicone resin can be used for thelight-transmissive member 5H. The light-transmissive member 5H mayinclude a wavelength conversion member. In a plan view, thelight-transmissive member 5H covers the upper surface and the lateralsurface of the light emitting element 1H, extends to the upper surfaceof the first substrate 10H, and is disposed so that the outer edge ofthe lower surface is in contact with the upper surface of the firstsubstrate 10H.

The first protrusion portion 41H is disposed across the outer edge 51 ofthe upper surface of the light-transmissive member 5H and the uppersurface of the first substrate 10H. For example, as illustrated in FIG.14B, in a cross-sectional view, the first protrusion portion 41H ispreferably disposed so that substantially half of the lower surface ofthe first protrusion portion 41H covers the outer edge 51 of the uppersurface of the light-transmissive member 5H and the other substantiallyhalf is in contact with the upper surface of the first substrate 10H.Note that in the light emitting device 101, the light-transmissivemember 5H may be disposed in a state where the reflective member isdisposed on the lateral surface so as to expose the upper surface of thelight emitting element 1H. In a case in which the reflective member isdisposed, the light-transmissive member 5H covers the upper surface ofthe light emitting element 1H and the upper surface and the lateralsurface of the reflective member and in contact with the upper surfaceof the first substrate 10H. The light emitting device 101 is disposed sothat the first protrusion portion 41H covers the outer edge 51 of theupper surface of the light-transmissive member 5H, in other words, theend portion of the light-transmissive member 5H is interposed betweenthe first protrusion portion 41H and the first substrate 10H, and thusthe adhesion between the light-transmissive member 5H and the firstsubstrate 10H can be improved, and the light emitting device 101 havinggood reliability can be achieved.

In the present embodiment, the light emitting element 1H is described asa single number, however, the present embodiment encompasses a form of aplurality of the light emitting element 1H.

Method for Manufacturing Light Emitting Device According to SecondEmbodiment

Next, a method for manufacturing the light emitting device 101 will bedescribed with reference to FIGS. 14C and 15A to 15D. FIG. 14C is aflowchart for describing a method for manufacturing a light emittingdevice according to the second embodiment. FIGS. 15A to 15D areschematic cross-sectional views illustrating the method formanufacturing the light emitting device according to the secondembodiment.

The method for manufacturing the light emitting device 101 includes asubstrate preparation step S10, an element placement step S11, alight-transmissive member disposing step S15, and a first protrusionportion disposing step S16. Note that in the method for manufacturingthe light emitting device 101, a reflective member disposing step S12may be performed between the element placement step S11 and thelight-transmissive member disposing step S15.

The substrate preparation step S10 is a step of preparing the firstsubstrate 10H including the element placement region 13H on the uppersurface. In this step S10, for example, the first substrate 10H isprepared with a wiring line that electrically connects to the elementelectrodes of the light emitting elements 1 formed in the elementplacement region 13H of the first substrate 10H. Note that the firstsubstrate 10H can be provided with a wiring line that makes anelectrical connection with the outside on a substrate lower surface, aperipheral edge of the element placement region on the substrate uppersurface, or on a substrate lateral surface.

The element placement step S11 is a step of placing the light emittingelements 1H in the element placement region 13H of the first substrate10H. The light emitting element 1H can be flip chip mounted in theelement placement region 13H on the first substrate 10H via anelectrically conductive bond member such as, for example, eutecticsolder, a conductive paste, a bump, plating, and the like.

The light-transmissive member disposing step S15 is a step of disposingthe light-transmissive member 5H covering the light emitting element 1H.For the light-transmissive member 5H, for example, a resin containing awavelength conversion member formed into a sheet-like shape may be used.Specifically, the uncured light-transmissive member 5H formed into asheet-like shape having a predetermined size is prepared and is disposedon the light emitting element 1H using the collet 60 or the like. Thelight-transmissive member 5H may be fixed on the light emitting element1H via a light-transmissive bond member such as a resin, or may be fixedusing the tackiness property of the light-transmissive member or thelike without using a bond member. The light-transmissive member 5H usedmay have a size greater than the area of the upper surface of the lightemitting element 1H so that the outer edge of the lower surface comesinto contact with the upper surface of the first substrate 10H.

The first protrusion portion disposing step S16 is a step of disposingthe first protrusion portion 41H along the outer edge 51 of the uppersurface of the light-transmissive member 5H and extending over the uppersurface of the first substrate 10H and the upper surface of thelight-transmissive member 5H. In the first protrusion portion disposingstep S16, for example, the first protrusion portion 41H can be disposedby supplying the uncured resin for forming the first protrusion portion41H from the nozzle of a dispenser while moving the nozzle along theouter edge 51 of the upper surface of the light-transmissive member 5H.Note that in a case in which the first protrusion portion 41H isdisposed, the step of the outer edge 51 of the light-transmissive member5H takes the role of a waterproof bank that tries to prevent the resinof the first protrusion portion 41H from flowing on the upper surface ofthe light-transmissive member 5H.

Through each of the steps described above, the light emitting device 101can be manufactured. Note that the light emitting device 101 may be usedby placing the first substrate 10H on the second substrate.

Furthermore, as illustrated in FIG. 16 , a light emitting device 100Dmay include a recessed portion 24 in the upper surface of a secondsubstrate 20D and may include a substrate placement region 23D in therecessed portion 24. In this manner, by the light emitting device 100Dincluding the recessed portion 24 of the second substrate 20D where thesubstrate placement region 23D is formed, the overall thickness can bereduced.

Furthermore, in each of the light emitting devices described above, thefirst protrusion portion may be disposed in parts and arranged in astraight line along the opposing sides of the light-transmissive member,for example. In this case also, the first protrusion portion extendsacross the upper surface of the light-transmissive member and the uppersurface of the first substrate.

Certain embodiments of a light emitting device and a method formanufacturing the light emitting device have been described above, butthe present invention is not limited to these embodiments, and should bebroadly construed based on the claims. It is to be further noted thataspects of the present invention described with respect to oneembodiment may be incorporated in a different embodiment although notspecifically described with respect thereto. That is, all embodimentsand/or features of any embodiment can be combined in any way and/orcombination. In addition, it is needless to say that variousmodifications, variations, and the like based on this description arealso included within the spirit of the present disclosure.

The light emitting devices 100, 101 according to embodiments of thepresent disclosure can be used for various light sources such asheadlights for vehicles, a projector, lighting, and the like.

1. A method for manufacturing a light emitting device, comprising:preparing a first substrate having an upper surface comprising anelement placement region; placing a light emitting element in theelement placement region; disposing an uncured, sheet-likelight-transmissive member on the light emitting element and bringing anouter edge of a lower surface of the light-transmissive member intocontact with an outer upper surface of the element placement region ofthe first substrate by pressing the light-transmissive member; anddisposing a first protrusion portion along an outer edge of an uppersurface of the light-transmissive member so that the first protrusionportion extends over the upper surface of the first substrate and theupper surface of the light-transmissive member.
 2. The method formanufacturing a light emitting device according to claim 1, wherein: inthe step of disposing the first protrusion portion, the first protrusionportion is disposed in a frame-like shape surrounding the elementplacement region.
 3. The method for manufacturing a light emittingdevice according to claim 1, wherein: the light-transmissive member hasa rectangular shape in a plan view.
 4. The method for manufacturing alight emitting device according to claim 1, wherein: in the step ofdisposing the first protrusion portion, the first protrusion portion isdisposed in a rectangular frame-like shape in a plan view.
 5. The methodfor manufacturing a light emitting device according to claim 1, wherein:in the step of placing the light emitting element, a plurality of thelight emitting elements are aligned in rows in the element placementregion.
 6. The method for manufacturing a light emitting deviceaccording to claim 1, further comprising: before the step of disposingthe light-transmissive member, disposing a reflective member that coversa lateral surface of the light emitting element such that an uppersurface of the light emitting element is exposed from the reflectivemember.
 7. The method for manufacturing a light emitting deviceaccording to claim 6, wherein: in the step of disposing thelight-transmissive member, the light-transmissive member covers thereflective member.
 8. The method for manufacturing a light emittingdevice according to claim 1, wherein: in the step of disposing the firstprotrusion portion, a top portion of the first protrusion portion isdisposed at a position higher than a top portion of thelight-transmissive member.
 9. The method for manufacturing a lightemitting device according to claim 1, wherein: the light-transmissivemember contains a phosphor.
 10. The method for manufacturing a lightemitting device according to claim 1, further comprising: before thestep of disposing the light-transmissive member, preparing a supportfilm on which the light-transmissive member is disposed, wherein: thestep of disposing the light-transmissive member comprises disposing thelight-transmissive member on the light emitting element with the supportfilm held by a collet, and pressing the outer edge of the upper surfaceof the light-transmissive member with the collet with the support filminterposed therebetween.
 11. The method for manufacturing a lightemitting device according to claim 1, wherein: the light-transmissivemember has a rectangular shape in a plan view; and in the step ofpressing the outer edge included in the disposing of thelight-transmissive member, the collet presses at least two opposingsides of four sides of the outer edge of the light-transmissive member.12. The method for manufacturing a light emitting device according toclaim 1, further comprising: preparing a second substrate having anupper surface that comprises a substrate placement region; after thestep of placing of the light emitting element, placing the firstsubstrate in the substrate placement region of the second substrate;disposing a wire that electrically connects the first substrate and thesecond substrate; and after the step of disposing the first protrusionportion, disposing a covering member that covers the wire, wherein: inthe step of disposing the covering member, the covering member isbrought into contact with the first protrusion portion and disposedoutward of the first protrusion portion.
 13. The method formanufacturing a light emitting device according to claim 12, wherein: inthe step of disposing the first protrusion portion, the first protrusionportion is disposed so that an interface between the first protrusionportion and the covering member has a curved shape protruding to acovering member side.